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  • Xeon Dual Core

  • SL9ZH Intel Xeon Dual-Core 3060 2.4GHZ 4MB L2 CACHE 1066MHZ FSB Socket PLGA-775 65NM 65W Processor | New Bulk Pack

SL9ZH Intel Xeon Dual-Core 3060 2.4GHZ 4MB L2 CACHE 1066MHZ FSB Socket PLGA-775 65NM 65W Processor | New Bulk Pack

$58.49 $108.21
Description Product overview of the Intel SL9ZH The SL9ZH Intel Xeon Dual-Core 3060 2.4GHZ 4MB L2 CACHE 1066MHZ FSB Socket PLGA-775 65NM 65W Processor is a central processing unit (CPU) developed by Intel Corporation, which is used in server systems and workstations. In this article, we will delve into the technical details of this processor, explaining what each of the specifications means and how they contribute to the overall performance of the processor. Processor Architecture and Manufacturing Process The SL9ZH Intel Xeon Dual-Core 3060 is based on the Intel Core microarchitecture, which is a more efficient and advanced version of the previous NetBurst microarchitecture used in earlier generations of Intel processors. This microarchitecture is designed to improve performance while reducing power consumption. The processor is manufactured using a 65nm process technology, which means that the transistors on the chip are 65 nanometers in size. This smaller size allows for greater efficiency and lower power consumption. The processor has a thermal design power (TDP) of 65 watts, which indicates the amount of power required to operate the processor. Clock Speed and Cache The clock speed of a processor determines how many instructions it can execute per second. The SL9ZH Intel Xeon Dual-Core 3060 has a clock speed of 2.4GHz, which means it can execute 2.4 billion instructions per second. This clock speed is relatively low compared to modern processors, which can have clock speeds of 3GHz or higher. However, for the time it was released, the clock speed was considered to be sufficient for most server and workstation tasks. The processor has a 4MB L2 cache, which is a type of memory used to store frequently accessed data. The cache helps to reduce the time it takes for the processor to access data from the main memory, which can improve overall performance. The 4MB size of the cache is considered to be relatively large for a processor of this generation. Front Side Bus (FSB) The front side bus (FSB) is a communication channel that connects the processor to other components in the system, such as the memory and input/output devices. The SL9ZH Intel Xeon Dual-Core 3060 has an FSB speed of 1066MHz, which indicates the maximum data transfer rate between the processor and other components. Socket Type The processor is designed to be used in a socket PLGA-775, which is a type of socket used for Intel processors. The socket type determines how the processor connects to the motherboard and other components in the system. The PLGA-775 socket is compatible with many different types of motherboards, which makes it a popular choice for server and workstation systems. Dual-Core Technology The SL9ZH Intel Xeon Dual-Core 3060 processor is a dual-core processor, which means it has two cores or processing units on a single chip. This allows the processor to execute multiple instructions simultaneously, which can improve overall performance. Dual-core technology was relatively new at the time this processor was released, and it was considered to be a significant improvement over single-core processors. Hyper-Threading Technology Hyper-Threading Technology is a feature in some Intel processors that allows each core to process two threads simultaneously, effectively doubling the number of processing threads in the system. The SL9ZH Intel Xeon Dual-Core 3060 does not support Hyper-Threading Technology, which means it can only process two threads at a time. General Information about the Intel SL9ZH Manufacturer: Intel Model Number or SKU# SL9ZH Product Type : Server Processor Technical Information Processor Core : Dual-Core Clock Speed : 2.4 Ghz Front Side Bus(Fsb) : 1066 Mhz Instruction Set : 64-Bit Cache Memory Detail L2 Cache : 4 MB Lithography : 65 NM Max Thermal Design Power (TDP) : 65 W Compatible Processor Socket : PLGA-775 Advanced Technologies Virtualization Technology Extended Memory 64 Technology Enhanced Speedstep Technology Thermal Monitoring Technologies Additional Information Execute Disable Bit Idle States Environmental Conditions Thermal Specification : 140.18°F (60.1°C)
Xeon Dual Core

Xeon Dual Core

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